Продукция
Диаметр 100 ± 0.2 мм
Diameter 100 ± 0.2 mm 100 ± 0.2 mm 100 ± 0.2 100 ± 0.2
Type / Dopant P/Boron P/Boron N/Phosphorus Customer Specified
Orientation <100> ± 1° <100> ± 1° <100> ± 1° Customer Specified
Growth Method Cz Cz Cz Cz
Resistivity 10 - 30 Ω-cm 1 - 100 Ω-cm 1 - 100 Ω-cm Customer Specified
Thickness 500 - 550μm 450 - 550μm 500 - 550μm Customer Specified
TTV < 10μm <= 10μm Customer Specified
TIR < 6μm
Front Surface Polished Polished Polished Polished
Back Surface Etched Polished Etched Customer Specified
Particle Count < 10 @ 0.3
Flats 2 SEMI Standard 2 SEMI Standard 2 SEMI Standard 2 SEMI Standard
Edges Rounded and polished per SEMI Standard Rounded and polished per SEMI Standard Rounded and polished per SEMI Standard Rounded and polished per SEMI Standard
Диаметр 125 ± 0.2 мм
Diameter 125 ± 0.2 mm
Type / Dopant P/Boron
Orientation <100> ± 1°
Growth Method Cz
Resistivity 10 - 20 Ω-cm
Thickness 600 - 650μm
TTV < 10μm
Bow / Warp < 40μm
Front Surface Polished
Back Surface Etched
Particle Count <= 10 @>= 0.3μm
Flat 2 SEMI Standard
Edges Rounded and polished per SEMI Standard
Диаметр 150 ± 0.2 мм
Diameter 150 ± 0.2 mm 150 ± 0.2 mm 150 ± 0.2 150 ± 0.2
Type / Dopant P/Boron N/Phosphorus P/Boron P/Boron
Orientation <100> ± 1° <100> ± 1° <100> ± 1° <100> ± 1°
Growth Method Cz Cz Cz Cz
Resistivity 1 - 30 Ω-cm 1 - 30 Ω-cm 10 - 30 Ω-cm 10 - 30 Ω-cm
Oxygen Content 27 - 33 ppma
Oxygen Stacking Faults (OSF) <= 100/cm²
Carbon Content <= 1.0 ppma
Metals < 5x10E
Thickness 650 - 700μm 650 - 700μm 660 - 690μm 660 - 690μm
TTV < 10μm <= 5μm <= 3μm <= 10μm
Bow / Warp < 40μm < 40μm < 40μm < 40μm
Site Flatness (STIR) < 1μm < 1μm < 0.2μm < 4μm
Front Surface Polished Polished Polished Polished
Back Surface Etched Etched Etched Etched
Particle Count <= 30 @ >= 0.2μm <= 30 @ >= 0.2μm <= 20 @ >= 0.2μm <= 30 @ >= 0.2μm
Flats 2 SEMI Standard 2 SEMI Standard 2 SEMI Standard 2 SEMI Standard
Edges Rounded and polished per SEMI Standard Rounded and polished per SEMI Standard Rounded and polished per SEMI Standard Rounded and polished per SEMI Standard
Диаметр 200 ± 0.2 мм
Diameter 200 ± 0.2 mm 200 ± 0.2 mm 200 ± 0.2 200 ± 0.2 200 ± 0.2 200 ± 0.2
Type / Dopant P/Boron P/Boron P/Boron P/Boron P/Boron P/Boron
Orientation <100> ± 1° <100> ± 1° <100> ± 1° <100> ± 1° <100> ± 1° <100> ± 1°
Growth Method Cz Cz Cz Cz Cz Cz
Grade Epi
Resistivity 10 - 30 Ω-cm 10 - 20 Ω-cm 1 - 100 Ω-cm 1 - 50 Ω-cm 0.005 - 0.02 Ω-cm Customer Specified
Metals < 5xE9 < 5xE10 < 5xE10 < 5xE9
Thickness 700 - 750μm 710 - 740μm 700 - 750μm 700 - 750μm 700 - 750μm 700 - 750μm
Epi Layer Thickness Customer Specified
TTV < 3μm <= 6μm <= 4μm <= 10μm <= 5μm <= 10μm
GTIR < 5μm <= 5μm
Bow / Warp < 40μm < 40μm < 40μm < 50μm < 40μm < 40μm
Site Flatness (STIR) < 1μm < 2μm < 0.2μm < 1μm
Front Surface Polished Polished Polished Polished Polished Polished
Back Surface Etched Etched Etched Etched Etched Etched or Oxide Back Seal
Particle Count <= 50 @ >= 0.12μm <= 50 @ >= 0.16μm <= 50 @ >= 0.16μm <= 30 @ >= 0.2μm <= 50 @ >= 0.16μm
Flats SEMI Standard SEMI Standard SEMI Standard SEMI Standard SEMI Standard SEMI Standard
Edges Rounded and polished per SEMI Standard Rounded and polished per SEMI Standard Rounded and polished per SEMI Standard Rounded and polished per SEMI Standard Rounded and polished per SEMI Standard Rounded and polished per SEMI Standard
Диаметр 300 ± 0.5 мм
Diameter 300 ± 0.5 mm 300 ± 0.5 mm 300 ± 0.5 mm 300 ± 0.5 mm 300 ± 0.5 mm 300 ± 0.5 mm P+ 300 ± 0.5 mm P+ 300 ± 0.5 mm P+ 300 ± 0.5 mm
Type / Dopant P/Boron P/Boron P/Boron P/Boron P/Boron P/Boron P/Boron P/Boron P/Boron
Orientation <100> ± 1° <100> ± 1° <100> ± 1° <100> ± 1° <100> ± 1° <100> ± 1° <100> ± 1° <100> ± 1° <100> ± 1°
Growth Method Cz Cz Cz Cz Cz Cz Cz Cz Cz
Resistivity 1 - 30 Ω-cm 1 - 30 Ω-cm 1 - 30 Ω-cm 1 - 100 Ω-cm 1 - 100 Ω-cm 1 - 100 Ω-cm 0.005 - 0.02 Ω-cm 0.005 - 0.02 Ω-cm 0.005 - 0.02 Ω-cm
Radial Resistivity Gradient (RRG) <= 10% <= 10%
Oxygen Concentration <= 30 ppma <= 30 ppma
Carbon Concentration <= 1 ppma <= 1 ppma
Surface Metals <= 1xE10 <= 1xE10
Thickness 750 - 800μm 750 - 800μm 750 - 800μm 750 - 800μm 750 - 800μm 750 - 800μm 750 - 800μm 750 - 800μ 750 - 800μm
TTV < 2μm <= 2μm <= 2μm <= 2μm <= 2μm <= 2μm <= 2μm
GTIR < 5μm <= 5μm
Site Flatness (STIR) < 0.25μm < 0.25μm <= 0.13μm
Bow / Warp < 40μm < 40μm < 40μm
Front Surface Polished Polished Polished Polished Polished Polished Polished Polished Polished
Back Surface Polished Polished Polished Polished Polished Polished Polished Polished Polished
Particle Count <= 50 @ >= 0.09μm <= 50 @ >= 0.12μm <= 50 @ >= 0.16μm <= 30 @ >= 0.2μm <= 100 @ >= 0.2μm <= 50 @ >= 0.12μm <= 50 @ >= 0.16μm <= 200 @ >= 0.2μm
Notch SEMI Standard SEMI Standard SEMI Standard SEMI Standard SEMI Standard SEMI Standard SEMI Standard SEMI Standard

Sputtering Targets & Line Card

We offer many types of Wafers, Substrates, Sputtering Targets, Evaporation Materials etc. for Education, Research & Industrial Laboratories.

Crystal Substrates

Al2O3 (Sapphire), AlN Template ( Epi film on Sapphire), BaF2, BaTiO3, BaTiO3 doped Ce or Rh, Bi12GeO20 (BGO20 ), Bi3Ge4O12 (BGO12), CaCO3 (Calcite), CaF2, CdS, CdSe, CdTe / CZT, CdWO4, Ce: Lu2SiO5, CeO2 Epi Film on YSZ, CsI(Tl), CsI(Tl), GaAs, GaN Crystal & Epi Template, GaP, GaSb, GdScO3, Ge, GGG (Gd3Ga5O12), InAs, InP, InSb, KTaO3, KTN (KTaNbO3), LaAlO3, LaF3, LiAl O2, LiF, LiGaO2, LiNbO3, LiTaO3, LSAT, MgAl2O4 (spinel), MgF2, MgO, NaCl, NdCaAlO4, NdGaO3, PbWO4, PMNT, SBN, Si ( Bare wafer / Thermal oxide wafer ), SiC Wafer (4H & 6H), SiO2 (fused silica), SiO2 (single crystal quartz), SrLaAlO4, SrLaGaO4, SrTiO3, SrTiO3 with Nb and Fe doped, SrTiO3: Bi-Crystal Substrates, Te-Dy-Fe (Directionally solidified GMM), TeO2, TiO2 substrates, YAG (undoped), YAG: Ce doped, YAG:Nd doped, YAlO3, YSZ, YVO4, ZnO Undoped and Ga Doped, ZnS, ZnSe, ZnTe and many more.

Epitaxial Films on Substrate

Epitaxial Films on Substrate, CeO2 Epi. Films on YSZ & NiW alloy, GaN Epi. Film on Sapphire, GaN Epi. Film on Sapphire

Ceramic Substrates

Aluminum Nitride Substrates: AlN, Aluminum Oxide Substrates Al2O3, Fused Silica Substrates: SiO2, YSZ (Yittrium stablized ZrO2)

Metallic substrates, including polycrystaline metallic and single crystal metal

Aluminum Crystal & Substrates (single crystal), Cu Crystal / Substrates ( single crystal), Nickel Substrate (polycrystalline), Titanium Substrate (Polycrystalline)

Silicon Wafers / Substrates

1 & 2 Inch, 3 inch, 100mm, 125mm, 150mm, 200mm, 300mm and thick film bonded SOI (Silicon On Insulator) wafers in P(100), N(100), P(111), and N(111) types & orientations.

Prime, Test, Reclaim Test, and Solar grades are available.

Quartz Wafers / Substrates

3” dia x 0.50 / 1.00 mm thick, 4” dia x 0.50 / 1.00mm thick, 6” dia x 0.80 / 1.20 mm thick, 8” dia x 0.80 / 1.20mm thick, 12” dia x 0.80 / 1.20mm thick, Thin Wafers: 3”/ 4” dia x 0.19mm thick, Quartz CMP Grade Dummy Wafers: 8” dia x 1.5mm thick, 12” dia x 1.5mm thick We also offer Borosilicate, Sodalime, Sapphire & Glass wafers in standard size and also made to your exact specifications

Sputtering Target & Evaporation Materials List

Pure elements

Aluminum (Al)

Hafnium (Hf)

Rubidium (Rb)

Antimony (Sb)

Indium (In)

Ruthenium (Ru)

Arsenic (As)

Iridium (Ir)

Samarium (Sm)

Barium (Ba)

Iron (Fe)

Selenium (Se)

Beryllium (Be)

Lanthanum (La)

Silicon (Si)

Bismuth (Bi)

Lead (Pb)

Silver (Ag)

Boron (B)

Magnesium (Mg)

Tantalum (Ta)

Cadmium (Cd)

Manganese (Mn)

Tellurium (Te)

Calcium (Ca)

Molybdenum (Mo)

Terbium (Tb)

Carbon (C)

Neodymium (Nd)

Tin (Sn)

Cerium (Ce)

Nickel (Ni)

Titanium (Ti)

Chromium (Cr)

Niobium (Nb)

Tungsten (W)

Cobalt (Co)

Osmium (Os)

Vanadium (V)

Copper (Cu)

Palladium (Pd)

Ytterbium (Yb)

Erbium (Er)

Praseodymium (Pr)

Yttrium (Y)

Gadolinium (Gd)

Platinum (Pt)

Zinc (Zn)

Gallium (Ga)

Rare Earth Metals

Zirconium (Zr)

Germanium (Ge)

Rhenium (Re)


Gold (Au)

Rhodium (Rh)


Alloys

Aluminum-Copper (AlCu)

Copper-Nickel (Cu-Ni)

Nickel-Vanadium (NiV)

Aluminum-Silicon (AlSi)

Gold-Germanium (AuGe)

Nickel-Zirconium (NiZr)

Aluminum-Silicon-Copper(AlSiCu)

Gold-Tin (AuSn)

Titanium-Aluminum (Ti-Al)

Chromium-Iron (CrFe)

Gold-Zinc (AuZn)

Titanium-Tungsten (TiW)

Chromium-Silicon (CrSi)

Nickel-Chromium (NiCr)

Titanium – Zirconium (Ti-Zr)

Cobalt-Chromium-Platinum (Co-Cr-Pt)

Nickel-Chromium-Iron( NiCrFe)

Tungsten-Titanium (WTi)

Cobalt-Iron (CoFe)

Nickel-Iron (NiFe)

Cobalt-Nickel (CoNi)

Nickel-Titanium (NiTi)



Borides

Aluminum Boride

Molybdenum Boride (Mo2B5)

Titanium Boride (TiB2)

Chromium Boride (CrB2)

Niobium Boride (NbB2)

Tungsten Boride (W2B)

Hafnium Boride

Rare Earth Borides

Vanadium Boride (VB2)

Lanthanum Boride (Lab6)

Tantalum Boride (TaB)

Zirconium Boride (ZrB2)

Carbides

Aluminum Carbide

Niobium Carbide (NbC)

Tungsten Carbide (WC)

Boron Carbide (B4C)

Silicon Carbide (SiC)

Vanadium Carbide (VC)

Chromium Carbide (Cr3C2)

Tantalum Carbide (TaC)

Zirconium Carbide (ZrC)

Hafnium Carbide

Titanium Carbide (TiC)


Molybdenum Carbide (Mo2C)

Tungsten-Cobalt Carbide


Fluorides

Aluminum Fluoride (AlF3)

Gadolinium Fluoride (GdF3)

Praseodymium Fluoride (PrF3)

Barium Fluoride (BaF2)

Hafnium Fluoride

Rare Earth Fluorides

Beryllium Fluoride (BeF2)

Lanthanum Fluoride (LaF3)

Terbium Fluoride (TbF3)

Cadmium Fluoride

Lead Fluoride

Yttrium Fluoride

Calcium Fluoride (CaF2)

Lithium Fluoride

Zirconium Fluoride

Cerium Fluoride (CeF3)

Magnesium Fluoride (MgF2)

Cryolite (Na3AlF6)

Erbium Fluoride (ErF3)

Neodymium Fluoride (NdF3)


Nitrides

Aluminum Nitride (AlN)

Silicon Nitride (Si3N4)

Vanadium Nitride (VN)

Boron Nitride (BN)

Tantalum Nitride (TaN)

Zirconium Nitride (ZrN)

Niobium Nitride (NbN)

Titanium Nitride (TiN)



Oxides

Aluminum Oxide (Al2O3)

Lanthanum Oxide (La2O3)

Rare Earth Oxides

Antimony Oxide (Sb2O3)

Lead Oxide (PbO)

Silicon Dioxide (SiO2)

Bismuth Oxide (Bi2O3)

Lead Titanate

Silicon Monoxide

Bi Barium Oxide (BaO)

Lead Zirconate

Tantalum Pentoxide

Bi Bismuth Titanate (Bi2Ti4O11)

Lithium Niobate

Tin Oxide (SnO)

Cerium Oxide (CeO2)

Lithium-Cobalt Oxide

Titanium Dioxide (TiO2)

Cobalt-Chrome Oxide (CoCr2O4)

Lutetium-Iron Oxide (garnet)

Tungsten Oxide (WO3)

Chromium Oxide (Cr2O3)

Magnesium Oxide (MgO)

Yttrium Oxide (Y2O3)

Chromium Oxide (Eu doped)

Magnesium-Aluminum Oxide

Tantalum Oxide (Ta2O2)

Copper Oxide (CuO)

Magnesium-Zirconium Oxide

Vanadium Oxide (V2O3)

Erbium Oxide (Er2O3)

Molybdenum Oxide (MoO3)

Yttrium Oxide (Y2O3)

Gadolinium Oxide (Gd2O3)

Neodymium Oxide (Nd2O3)

Yttrium-Aluminum Oxide

Gallium Oxide (Ga2O3)

Nickel-Chrome Oxide

Zinc Oxide (ZnO)

Germanium Oxide (GeO3)

Nickel-Cobalt Oxide

Hafnium Oxide (HfO2)

Niobium Pentoxide (NbO5)

Zinc Oxide/Aluminum Oxide

Indium Oxide (In2O3)

Praseodymium Oxide (Pr6O11)

Zirconium Oxide (ZrO2)

Indium-Tin Oxide (ITO)

Rare Earth Garnets

Iron Oxide (Fe2O3)

Zirconium-Magnesium Oxide

Samarium Oxide (Sm2O3)




Precious Metals

Gold (Au)

Iridium (Ir)

Rhenium (Re)

Silver (Ag)

Osmium (Os)

Rhodium (Rh)

Gold Arsenic (AuAs)

Palladium (Pd)

Ruthenium (Ru)

Gold Tin (AuSn)

Platinum (Pt)


Silicides

Chromium Silicide (CrSi2)

Platinum Silicide (PtSi2)

Tungsten Silicide (WSi2)

Hafnium Silicide (HfSi2)

Rare Earth Silicides

Vanadium Silicide (VSi2)

Molybdenum Silicide (MoSi2)

Tantalum Silicide (TaSi2)

Zirconium Silicide (ZrSi2)

Niobium Silicide (NbSi2)

Titanium Silicide (TiSi2)


Selenides, sulfides & tellurides

Antimony Sulfide

Copper Selenide

Tantalum Selenide

Antimony Selenide

Indium Telluride

Tantalum Sulfide

Antimony Telluride

Lead Selenide

Tin Selenide

Arsenic Sulfide

Lead Sulfide (PbS)

Tin Telluride

Bismuth Selenide

Lead Telluride

Tungsten Selenide

Bismuth Telluride (Bi2Te3)

Molybdenum Selenide (MoSe2)

Tungsten Sulfide

Cadmium Selenide (CdSe)

Molybdenum Sulfide (MoS2)

Zinc Selenide (Znse)

Cadmium Sulfide (CdS)

Niobium Selenide

Zinc Sulfide (ZnS)

Cadmium Sulfoselenide

Niobium Sulfide

Zinc Telluride (ZTe)

Cadmium Telluride (CdTe)

Rare Earth Sulfides


SELENIDES, SULFIDES & TELLURIDESБ

Backing Plates

We offer backing plates to support most of the commercial sputtering systems as well as custom designed backing plates for your specific requirements. Normally, most materials require high thermal and electrical conductivity. Hence OFHC copper is generally, used.

Depending on your specifications, other materials such as titanium, molybdenum, stainless steel or aluminum are available. Please specify the material, size and bonding requirements of the Backing Plates

Materials for Production, R & D of Thin Film Photovoltaic / Solar Cells

ZnO/Al2O3 98/2 wt%, ZnO/Al2O3 96/4 wt%, ZnO, ZnS/In, ZnS/Al2O3, ZnAl Pure Metal Molybdenum (High Purity, Melted and Sintered), Cu2O, Cu2Se, CuSe, In2Se3/Ga, InZn Pure Metal,R&D materials

If you need any other Sputtering Target or Evaporation Materials not listed here, please contact us. We are constantly adding new products.

Our Other Products

Silicon Wafers, Quartz Wafers, Opto-Electronics and Fiber Optics Products, OptiTemp Water Chillers- For Laser, Semiconductor, Medical, X-Ray & Laboratory Industrial Applications, NoIR CE-certified LaserShields, Laboratory Oven, Water Baths, Furnaces, Kilns, Incubators, Refrigerators& Freezers etc.